Renesas' first automotive grade low-power Bluetooth SoC DA14533

Bringing outstanding low energy consumption, small size, and system cost-effectiveness to the industry

On March 25, 2025, Beijing, China - Renesas Electronics (TSE: 6723), a global semiconductor solution provider, announced today the launch of its industry-leading new Bluetooth chip - DA14533. This chip will include an RF transceiver Arm?  M0+microcontroller, memory, peripherals, and security features are integrated into a compact System on Chip (SoC) design. As Renesas Low Energy Bluetooth? The DA14533, the first device in the SoC product family to pass automotive certification, features advanced power management capabilities that simplify system integration and reduce power consumption. With the certified Bluetooth Core Specification 5.3 software stack and extended temperature support, developers can quickly carry out diverse application development projects including tire pressure monitoring, keyless access control, wireless sensors, and battery management systems.

Optimized design for excellent energy efficiency

Based on Renesas' cutting-edge position in low-power Bluetooth SoC (SmartBond Tiny product family) and industry leading low-power technology, the new DA14533 integrates the most advanced power management functions in the industry: the product is equipped with an integrated DC-DC buck converter, which can accurately adjust the output voltage according to system requirements; In working condition, its system power consumption is significantly reduced compared to similar products in the market, requiring only 3.1mA for transmission and dropping to 2.5mA for reception; In sleep mode, the current is extremely low as 500nA. These power management and energy-saving features help significantly extend the lifespan of small battery powered systems and easily meet the stringent power consumption requirements in tire pressure monitoring system task configurations.

Passed AEC-Q100 automotive grade certification and equipped with the latest safety features

As a product that meets AEC-Q100 Level 2 standards, DA14533 means it has undergone rigorous testing to ensure excellent quality and reliability in extreme in car environments. In addition, the extended temperature range of this product (-40 to+105 ° C) can further ensure reliable performance under harsh conditions, making it an ideal choice for systems with high stability and durability requirements in automotive, industrial, and other fields. This product complies with Bluetooth Core Specification 5.3 and includes the latest security features to protect connected devices from various threats.

Chandana Pairla, VP of Connectivity Solutions Division at Renesas, said, "Our SmartBond Tiny SoC product family has achieved significant success in the industrial market, with shipments exceeding 100 million units to date. This new automotive grade product will help the new generation of battery powered cars and industrial systems explore new horizons in low-power Bluetooth applications, fully meeting the stringent requirements of these applications for high energy efficiency, small size, and wider temperature adaptability

Reduce BOM, lower costs, and simplify development

Similar to other low-power Bluetooth SoC devices in the SmartBond Tiny product family, DA14533 only requires 6 external components and provides the best engineering bill of materials (eBOM) in its class.

A single external crystal oscillator (XTAL) is used for both working and sleep modes, so there is no need to equip a separate oscillator for sleep mode. The ultra compact design of the WFFCQFN 22 pin 3.5mm x 3.5mm package makes it the smallest automotive grade low-power Bluetooth SoC on the market. Thanks to its compact design and simplified eBOM, this product can seamlessly integrate into space constrained systems, reducing overall system costs and shortening product time to market for customers.

Key features of DA14533

Arm Cortex-M0+microcontroller: used as a data pump in standalone application processors or host systems;

64KB RAM and 12KB one-time programmable (OTP) memory;

2.4GHz RF transceiver;

Integrated IQ buck DC-DC converter;

External SPI flash memory;

Single XTAL operation (single crystal oscillator);

Certified Bluetooth Core Specification 5.3 software stack;

Passed AEC-Q100 Level 2 certification, supporting a wide operating temperature range (-40 to+105 ° C);

WFFCQFN 22 pin 3.5mm x 3.5mm package.

Successful product portfolio

Renesas will combine this new low-power Bluetooth SoC with R-Car H3/M3/E3 SoC, PMIC, and timer devices to provide multiple "successful product combinations" solutions, including a "tire pressure monitoring system". Renesas' successful product portfolio relies on compatible and seamlessly collaborative devices, while adopting a technically validated system architecture that brings optimized low-risk designs and accelerates the product launch process. Based on the various products in its product lineup, Renesas has launched over 400 "successful product combinations" aimed at helping users drive the design process and accelerate the product launch process. For more information, please visit: renesas.com/win。

Supply information

DA14533 is now available and comes with a professional version of the low-power Bluetooth SoC development kit. This kit includes a motherboard, daughter board, and cables, making it easy to develop application software; Among them, the daughter board can also be purchased separately to simplify development. You can also refer to the blog about this new product. For more information about Renesas' low-power Bluetooth solution, please visit: Bluetooth Low Energy | Renesas。

About Renesas Electronics

Renesas Electronics (TSE: 6723), with technology making life easier, is committed to creating a safer, smarter, and more sustainable future. As a global microcontroller supplier, Renesas Electronics integrates expertise in embedded processing, simulation, power supply, and connectivity to provide complete semiconductor solutions. The successful product portfolio accelerates the launch of automotive, industrial, infrastructure, and IoT applications, empowering billions of connected smart devices to improve people's work and lifestyle.

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