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Da Da Da Da Quan Ding Group launches TWS headphone solution based on Qualcomm products

Post on Jan 01,1970

On April 15, 2025, Dalian University Holdings, a leading international semiconductor component distributor dedicated to the Asia Pacific market, announced that its subsidiary Quanding has launched a TWS headphone solution based on the Qualcomm Snapdragon S7+Sound Gen 1 platform.




In recent years, TWS earphones have rapidly become an important part of the audio equipment market due to their wireless connectivity, lightweight portability, and high sound quality, gradually replacing traditional wired earphones and becoming the mainstream choice for consumers. At the same time, with the continuous maturity of Bluetooth technology, chip technology, and sensor technology, the market size of TWS earphones continues to expand. According to relevant data, in the first three quarters of 2024, the global shipment of TWS earphones was about 257 million units, of which the shipment in the third quarter reached 92 million units, achieving a year-on-year increase of 15% and demonstrating huge development potential. In this context, DaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDaDa.

 



S7+Gen 1 is the first audio platform that supports Qualcomm Extended Personal Area Network (XPAN) technology and ultra-low power WiFi connectivity. It can extend audio transmission distance in homes, buildings, or parks, and supports lossless music quality up to 192kHz, bringing users unprecedented auditory enjoyment and audio experience.


The S7+Gen 1 platform is jointly constructed by QCC7226 and QCP7321 ICs. Among them, QCC7226 serves as the main control chip, responsible for running user applications, Bluetooth protocol processing, DSP audio data processing, and the operation of the AI algorithm platform; QCP7321, on the other hand, serves as a co processor, specifically providing WiFi transmission function and transmitting and receiving data with the main control chip through SPI interface. In terms of performance, the computing power of S7 Pro Gen 1 is 6 times that of its predecessor platform, and its AI performance is nearly 100 times that of its predecessor platform, bringing a new level of flagship performance with low power consumption.




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Figure 3- Block diagram of the TWS headphone solution based on Qualcomm products by DaDa DaDa Quan Ding



The TWS headphone solution launched by Quanding at the Grand Conference deeply integrates Qualcomm's technological advantages, not only meeting users' core needs for high-definition sound quality, long battery life, and low latency, but also achieving more intelligent interactive experience and personalized functions through innovative design ideas, further expanding the application scenarios and boundaries of TWS headphones.


Core technological advantages:

Fourth generation ANC noise reduction;

Seamless switching of Bluetooth WiFi links, XPAN supports full house coverage;

Hi res audio, supports loss less audio96k;

AI algorithm enhancement function;

Ultra low power consumption design.


Scheme specifications:

Multi core collaboration, processing doubling:

Adopting Arm Cortex-M55 core, with a main frequency of 1x300MHz, supporting FPU;

Sensor Arm Cortex-M4F core, clock speed 1X200MHz, supports FPU;

Artificial Intelligence: Qualcomm eNPU 64 GOPS DSP: 2 × 500MHz+1 × 250MHz.

WiFi specifications:

1 × 1 dual band 2.4/5 GHz, supporting 802.11a/b/g/n standards;

An 11n MCS3 HT20 data transmission rate of up to 28.9Mbps.

Supports IPv4/IPv6, TCP, UDP, and TLS 9;

Built in 128Mb FLASH;

Support Bluetooth coexistence;

Supports USB high-speed (480Mbps) devices;

The software provides multiple combination configurations to flexibly build various forms of Bluetooth audio products.




Regarding Dahua University Holdings:


Da Da Da Da Da Holdings is an internationally leading semiconductor component distributor dedicated to the Asia Pacific market. It was founded in 2005 and celebrates its 20th anniversary this year. Headquartered in Taipei, it has subsidiaries such as Shiping, Pinjia, Quanding, and Youshang, with approximately 5000 employees and over 250 authorized product suppliers. It has 69 service centers worldwide and achieved a revenue of NT $8805.5 billion in 2024. Dahua University has established an industrial holding platform, focusing on international operational scale and localized flexibility, and has long been deeply rooted in the Asia Pacific market. With the vision of "industry first choice - channel benchmark", it fully implements the core values of "team, integrity, professionalism, and efficiency", and has won the "Global Distributor Excellence Performance Award" for 24 consecutive years. At the same time, it continues to strengthen ESG sustainable development and has won international recognition for 3 consecutive years, with an MSCI ESG rating of A-level. Faced with the trend of new manufacturing, Dalian University is committed to transforming into a data-driven enterprise, establishing an online digital platform - "DaDaWang", and advocating the intelligent logistics service (LaaS, Logistics as a Service) model to assist customers in facing the challenges of intelligent manufacturing together. Starting from benevolence, building trust through technology, and adhering to the corporate purpose of "co creating partner value and achieving the future", Da Da Da Da Da hopes to build a highly competitive ecosystem with the industry "La Bang Jie Pai".

This is reported by Top Components, a leading supplier of electronic components in the semiconductor industry

They are committed to providing customers around the world with the most necessary, outdated, licensed, and hard-to-find parts.

Media Relations

Name: John Chen

Email: salesdept@topcomponents.ru