Shanghai, China, April 24, 2025- ROHM, a globally renowned semiconductor manufacturer headquartered in Kyoto, Japan, announced today the launch of the 4-in1 and 6-in1 structured SiC encapsulated module "HSDIP20". This series of products is highly suitable for applications such as PFC * 1 and LLC * 2 converters in xEV (electric vehicle) on-board chargers (hereinafter referred to as "OBC"). The product lineup of HSDIP20 includes 6 models with 750V withstand voltage (BSTxxxx1P4K01) and 7 models with 1200V withstand voltage (BSTxxxx2P4K01). By integrating the basic circuits required for various high-power applications into small module packages, it can effectively reduce customer design time and help achieve miniaturization of power conversion circuits in applications such as OBC.

HSDIP20_image_EcoSiC.jpg

HSDIP20 is equipped with an insulating substrate with excellent heat dissipation performance, which can effectively suppress the temperature rise of the chip even during high-power operation. In fact, in the PFC circuit commonly used in OBC (using 6 SiC MOSFETs), comparing the use of 6 top heat dissipation discrete devices with the use of 1 6-in1 structure HSDIP20 module under the same conditions, it was found that the temperature of HSDIP20 was about 38 ℃ lower than that of the discrete structure (when operating at 25W). This excellent heat dissipation performance allows the product to meet high current demands in a very small package. In addition, compared with top cooling discrete devices, the current density of HSDIP20 is more than three times higher; Compared with DIP modules of the same type, the current density is over 1.4 times higher, reaching an advanced level in the industry. Therefore, in the above-mentioned PFC circuit, the installation area of HSDIP20 can be reduced by about 52% compared to top cooling discrete devices, which is very advantageous for achieving miniaturization of power conversion circuits in applications such as OBC.

The new product has been temporarily put into mass production with a monthly production scale of 100000 units starting from April 2025 (sample price of 15000 yen per unit, excluding tax). The production bases for the previous process are ROHM Apollo CO., LTD. (Chikugo Factory, Fukuoka Prefecture, Japan) and Blue Sapphire Semiconductor Miyazaki Factory (Miyazaki Prefecture, Japan), while the production base for the subsequent process is ROHM Integrated Systems (Thailand) Co., Ltd. (Thailand). For samples or related information, please contact ROHM sales representative or inquire through the "Contact Us" section on the ROHM official website.

<Development Background>

In recent years, in order to achieve a carbon free society, the popularity of electric vehicles has further accelerated. In the field of electric vehicles, in order to extend the vehicle's range and improve charging speed, the batteries used are accelerating towards higher voltage levels. At the same time, the demand for increasing the output power of OBC and DC-DC converters is becoming increasingly prominent. On the other hand, the market also requires these applications to achieve miniaturization and lightweighting, with the core of improving power density. At the same time, there is an urgent need to achieve technological breakthroughs in improving heat dissipation performance that affects power density enhancement. The HSDIP20 developed by ROHM solves the increasingly difficult technical problem of discrete structures, which helps electric powertrain systems achieve higher power output and smaller size. In the future, ROHM will continue to develop SiC module products that combine miniaturization and efficiency, while also committed to developing vehicle mounted SiC IPMs that can achieve smaller volumes and higher reliability.

Product lineup

<Application Example>

Power conversion circuits such as PFC and LLC converters are also widely used in the primary side circuits of industrial equipment, so HSDIP20 can also provide support for miniaturization of application products in industrial equipment and consumer electronics fields.

Vehicle mounted equipment

Car charger (OBC), DC-DC converter, electric compressor, etc

Industrial equipment

EV charging station, V2X system, AC server, server power supply, PV inverter, power regulator, etc

<Support Information>

ROHM has equipment for conducting motor testing within the company, which can provide strong support at the application level. In order to accelerate the evaluation and application of HSDIP20 products, ROHM also provides various support resources, including rich solutions from simulation to thermal design, to help customers quickly adopt HSDIP20 products. In addition, ROHM also offers two evaluation kits for dual pulse testing and three-phase full bridge testing, which support evaluation under conditions close to actual circuit conditions. For detailed information, please contact ROHM sales representative or inquire through the "Contact Us" section on ROHM's official website.

<About the "EcoSiC?" brand>

EcoSiC? It is a component brand that uses silicon carbide (SiC), which is highly regarded in the field of power components due to its superior performance compared to silicon (Si). ROHM has been independently developing the necessary technologies for upgrading SiC products, from wafer production to manufacturing processes, packaging, and quality management methods. In addition, ROHM adopts a consistent production system in the manufacturing process, which has established its position as an advanced enterprise in the SiC field.

[Note] EcoSiC? It is a trademark or registered trademark of ROHM Co., Ltd.

*2) LLC Converter

A resonant DC-DC converter that can achieve high efficiency and low noise power conversion. The basic structure of its circuit is composed of two inductors (L) and one capacitor (C), hence it is called an LLC converter. By forming a resonant circuit, switching losses can be significantly reduced, making it very suitable for high efficiency applications such as OBC, industrial equipment power supplies, and server power supplies.

This is reported by Top Components, a leading supplier of electronic components in the semiconductor industry

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Media Relations

Name: John Chen

Email: salesdept@topcomponents.ru