On October 21, 2025, Dalian University Holdings, an international leading semiconductor component distributor dedicated to the Asia Pacific market, announced that its subsidiary Quanding has launched an IoT AI application development solution based on Qualcomm's RB3 Gen 2 development kit.

With the deep integration of 5G, AI and edge computing, IoT devices continue to evolve towards high-performance, intelligent and strong interconnection, which puts forward higher requirements for development platforms. It not only requires powerful hardware computing and flexible scalability, but also efficient AI processing capabilities as support. In this context, DaDaDa DaDa QuanDing has launched an IoT AI application development solution based on the Qualcomm RB3 Gen 2 development kit, aiming to provide developers with powerful hardware and software platform support, accelerate IoT application innovation and implementation.

The Qualcomm RB3 Gen 2 Development Kit is a high-performance development platform for the Internet of Things, with powerful AI computing capabilities, excellent graphics processing performance, and comprehensive software and hardware support. It can be widely used in multiple scenarios such as robotics, industrial automation, and enterprise equipment. This development kit is built on the Qualcomm QCS6490 platform and has significantly improved AI processing capabilities, inference speed, energy efficiency, and parallel network operation capabilities compared to previous generation products. RB3 Gen 2's AI computing power is as high as 12TOPS. Combined with device side machine learning and edge computing, it can process large-scale data in near real time to meet the needs of complex Internet of Things applications.

Qualcomm QCS6490 platform is designed for high-performance edge computing applications. It uses advanced architecture, integrates KryoTM 670 CPU and HexagonTM processor, and provides excellent connectivity and computing performance. The platform is also equipped with SpectraTM ISP 570L image processing engine, which can bring excellent photography and videography experience. In terms of video processing, AdrenoTM 633 VPU supports high-quality Ultra HD video encoding and decoding, while Adreno 1075 DPU supports both internal and external Ultra HD display outputs. In terms of connectivity performance, the platform has gigabit level Wi Fi 6E support, which can achieve high-speed and low latency data transmission.

In addition, in terms of software, the platform supports Qualcomm Linux - an integrated operating system designed specifically for the Qualcomm IoT platform, which includes a complete software stack, development tools, and documentation to help developers efficiently build AI applications.

Figure 3- Block diagram of the development plan for IoT AI applications based on Qualcomm products by DaDaDa DaDa Quan Ding

The Qualcomm RB3 Gen 2 development kit adopts a modular design, following the compact credit card size specification of 96Boards, and supports a series of mezzanine board extensions based on Vision Mezzanine, combining small size and high expandability. In addition, the kit offers a wide range of connection options, including multiple USB ports, Ethernet ports, camera and display ports, and supports various GPIO, which can simultaneously meet the needs of low-speed communication protocols and high-speed connections.

With high computing power and ease of use, this solution can bring powerful drivers and more possibilities for intelligent development. In the future, Da Da Da Da Da Quan Ding will continue to cooperate with advanced original factory partners in the industry, jointly promoting technological innovation and industrial integration, and bringing more cutting-edge and reliable solutions to the market.

Core technological advantages:

12 TOPS has high computing power and provides comprehensive demonstration applications and tutorials to accelerate the development of IoT applications;

Advanced ISPs can provide a single or multiple concurrent camera experience and offer excellent image and video capture capabilities;

AI powered security and visualization of workspaces;

Thanks to gigabit Wi Fi 6E, it achieves ultra fast wireless connectivity and low latency: up to 3.6Gbps, 160MHz, 4K QAM, DBS using MU-MIMO and OFDMA, and WPA3-P&E;

Bluetooth 5.2 and LE audio: clear sound quality, low latency, high reliability, and extended coverage range;

Low speed expansion supports GPIO, I2C, SPI, UART, and/or audio;

High speed expansion supports PCIe, USB, MIPI CSI/DSI, and/or SDIO, specifically designed for the intermediate board of 96Boards;

Supports multiple software development kits (SDKs) and tools, including Qualcomm Neural Processing SDK for artificial intelligence, Qualcomm Intelligent Multimedia Product SDK, Qualcomm Intelligent Robot Product SDK, Qualcomm HexagonTM DSP SDK, and multiple Linux distributions.

Scheme specifications:

Chip: QCS6490;

CPU: Eight core processor;

Memory (RAM): uMCP package (6 GB LPDDR4x);

Camera: The intermediate board is equipped with 2 C-PHY/D-PHY 30 pin expansion ports, including 1 IMX577 D-PHY 12 megapixel camera interface, 1 OV9282 D-PHY 1 megapixel camera interface with bracket, and additional D-PHY and GMSL compatible expansion ports;

GPU general-purpose processor: Adreno 643 GPU;

Video: Adreno 633 VPU: Supports 4K60 frame decoding/4K30 frame encoding;

Display: Supports simultaneous connection of two display screens: full-size HDMI interface, USB Type-C interface supporting DP replacement mode, mini DP interface, DSI expansion;

AI：12 TOPS；

WLAN/Bluetooth: 802.11ax (including DBS), Bluetooth 5.2, two sets of onboard printed antennas, RF expansion interface supporting external antennas;

Storage: uMCP package (128 GB UFS flash memory), 1 MicroSD card slot, supports NVMe PCIe expansion;

PCIe: 1 PCIe Gen 3 dual channel expansion interface, optional 1 PCIe Gen 3 single channel expansion interface;

USB: 1 USB 3.0 Type-C interface, 1 USB 2.0 interface with OTG function, 2 USB 3.0 Type-A interfaces, 1 high-speed expansion USB 3.0 interface;

Audio: 1x DMIC, 2x digital audio amplifier, low-speed interface supports I2S/Soundwire/DMIC expansion 4x DMIC, 2x digital audio amplifier, low-speed interface supports I2S/Soundwire/DMIC expansion;

Sensors: onboard IMU (ICM-42688), additional extended IMU (ICM-42688), pressure sensor (ICP-10111), magnetic sensor/compass (AK09915), additional extension.

About The Author

This is reported by Top Components, a leading supplier of electronic components in the semiconductor industry

They are committed to providing customers around the world with the most necessary, outdated, licensed, and hard-to-find parts.

Media Relations

Name: John Chen

Email: salesdept@topcomponents.ru

This is reported by Top Components, a leading supplier of electronic components in the semiconductor industry. They are committed to p with the most necessary, outdated, licensed, and hard-to-find parts.

Media Relations Name: John Chen

Email: salesdept@topcomponents.ru