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Sockets for ICs, Transistors

Records 11083
Page  9/370
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Assmann WSW Components
CONN SOCKET PLCC 84POS TIN
Package: -
Stock4,716
-
-
PLCC
84 (4 x 21)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock2,430
-
800
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
80µin (2.03µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
-
-
-
Polyester
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock7,758
-
800
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
-
Copper Alloy
Polyester
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN SOCKET SIP 30POS TIN
Package: -
Stock8,370
-
Diplomate DL
SIP
30 (1 x 30)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN SOCKET SIP 21POS TIN
Package: -
Stock6,660
-
Diplomate DL
SIP
21 (1 x 21)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock6,498
-
500
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
25µin (0.63µm)
Beryllium Copper
-
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 8POS TIN
Package: -
Stock8,010
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN SOCKET PLCC 84POS TIN
Package: -
Stock7,704
-
-
PLCC
84 (4 x 21)
0.050" (1.27mm)
Tin
100µin (2.54µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
100µin (2.54µm)
Phosphor Bronze
Thermoplastic
-
TE Connectivity AMP Connectors
CONN SOCKET PLCC 52POS TIN
Package: -
Stock6,336
-
-
PLCC
52 (4 x 13)
0.050" (1.27mm)
Tin
100µin (2.54µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
100µin (2.54µm)
Phosphor Bronze
Thermoplastic
-
TE Connectivity AMP Connectors
CONN SOCKET PLCC 68POS TIN
Package: -
Stock4,734
-
PCS
PLCC
68 (4 x 17)
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Polyphenylene Sulfide (PPS)
-
3M
CONN SOCKET BGA 49POS GOLD
Package: -
Stock3,580
-
Textool?
BGA
49 (Verification Required)
0.039" (1.00mm)
Gold
-
-
Through Hole
Closed Frame
-
-
-
-
-
-
-
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock6,408
-
800
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
20µin (0.51µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
20µin (0.51µm)
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN SOCKET PLCC 44POS TIN
Package: -
Stock5,760
-
PCS
PLCC
44 (4 x 11)
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
180µin (4.57µm)
Copper Alloy
Polyphenylene Sulfide (PPS)
-
Amphenol FCI
CONN SOCKET PLCC 68POS TIN
Package: -
Stock8,532
-
-
PLCC
68 (4 x 17)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-55°C ~ 125°C
Amphenol FCI
CONN SOCKET PLCC 20POS TIN
Package: -
Stock4,032
-
-
PLCC
20 (4 x 5)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-55°C ~ 125°C
Amphenol FCI
CONN SOCKET PLCC 28POS TIN
Package: -
Stock5,346
-
-
PLCC
28 (4 x 7)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN SOCKET PGA ZIF 370POS GOLD
Package: -
Stock5,202
-
-
PGA, ZIF (ZIP)
370 (19 x 19)
0.100" (2.54mm)
Gold
Flash
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Copper Alloy
Liquid Crystal Polymer (LCP)
-
TE Connectivity AMP Connectors
CONN SOCKET PGA ZIF 370POS GOLD
Package: -
Stock3,384
-
-
PGA, ZIF (ZIP)
370 (19 x 19)
0.100" (2.54mm)
Gold
Flash
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Copper Alloy
Liquid Crystal Polymer (LCP)
-
TE Connectivity AMP Connectors
CONN SOCKET PGA ZIF 370POS GOLD
Package: -
Stock6,066
-
-
PGA, ZIF (ZIP)
370 (19 x 19)
0.100" (2.54mm)
Gold
Flash
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Copper Alloy
Liquid Crystal Polymer (LCP)
-
TE Connectivity AMP Connectors
CONN SOCKET PGA ZIF 370POS GOLD
Package: -
Stock3,132
-
-
PGA, ZIF (ZIP)
370 (19 x 19)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Copper Alloy
Liquid Crystal Polymer (LCP)
-
TE Connectivity AMP Connectors
CONN SOCKET PGA ZIF 370POS GOLD
Package: -
Stock7,506
-
-
PGA, ZIF (ZIP)
370 (19 x 19)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Copper Alloy
Liquid Crystal Polymer (LCP)
-
TE Connectivity AMP Connectors
CONN SOCKET PGA ZIF 321POS GOLD
Package: -
Stock7,056
-
-
PGA, ZIF (ZIP)
321 (19 x 19)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Copper Alloy
Thermoplastic
-
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 24POS TIN
Package: -
Stock4,068
-
-
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
-
-40°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 48POS TIN
Package: -
Stock4,302
-
-
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
-
-40°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 40POS TIN
Package: -
Stock2,826
-
-
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
-
-40°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 32POS TIN
Package: -
Stock2,610
-
-
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
-
-40°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 28POS TIN
Package: -
Stock8,910
-
-
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
-
-40°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 48POS TIN
Package: -
Stock5,256
-
-
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
-
-40°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 42POS TIN
Package: -
Stock8,640
-
-
DIP, 0.6" (15.24mm) Row Spacing
42 (2 x 21)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
-
-40°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 40POS TIN
Package: -
Stock4,050
-
-
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
-
-40°C ~ 105°C